The main pain point: a perfect storm of costs and visibility

The number one pain point for industrial buyers in 2026 is not an outright shortage like 2021-2022. It is the unpredictable volatility across pricing, lead times, and geopolitics simultaneously, making any planning extremely difficult.

Lead times climbed steadily for 12 months before peaking with a dramatic spike in March 2026, a 67% increase in a single month between February and March, with lead times reaching 40 weeks on certain components. The market had never truly normalized after the post-Covid shortage cycle.

What makes the situation particularly toxic:

When tariffs are announced, threatened, or merely rumored, rational buyers pull purchases forward. This demand compression reduces available stock and drives spot market premiums up almost overnight. Components that were stable at book price for much of 2025 have seen spot market premiums multiply by 2 to 5 times, and even higher in some categories.

The most significant hidden pain point is not price itself. It is part identity and data mismatch: teams waste hours confirming that the reference listed in the BOM is actually the same part a supplier is quoting.

Only 18% of companies have achieved end-to-end visibility across their supply chain. For the majority, the reality looks like fragmented email threads, missed messages due to time zone differences, and the constant fear that something important has slipped through the cracks.

The hardest components to source (excluding memory)

SiC MOSFETs and IGBTs: maximum criticality

SiC MOSFETs, a key technology for electric vehicles and onboard chargers, are in a critical situation at ON Semiconductor. Demand from automotive manufacturers is outpacing available capacity. EV procurement teams must treat SiC allocation as a strategic priority through at least the first half of 2026. Lead times for AEC-Q100 qualified 32-bit MCUs have reached 52 weeks or more across several families. These parts are expected to remain difficult to source through 2028.

Industrial and automotive MCUs on mature nodes

The MCU price war ended in 2025. STMicro, TI, NXP, and Infineon announced price increases effective April 2026, with TI reaching up to 85% increases on certain part numbers. Foundries on mature nodes (40nm to 180nm) critical for industrial MCUs are sold out for all of 2026. STMicro MCU lead times had already reached 55 weeks and the situation is likely to worsen.

Analog and power management components (PMIC, op-amps, ADC/DAC)

The most acute pressure is concentrated on components manufactured on older process nodes, from 90nm to 350nm. These nodes produce analog ICs, power management chips, discretes, and interface chips that appear on virtually every industrial BOM. Precision op-amps, ADCs, DACs, and voltage references used in industrial sensors and medical equipment are seeing a return to allocation. Analog Devices applied 15% price increases across its entire catalog, and 30% on approximately 1,000 military-grade references.

GaN: emerging but already constrained

Chinese export controls on gallium and germanium, implemented in mid-2025, triggered alarm bells as China dominates these supply chains. This adds supply risk for compound semiconductor components such as GaAs and GaN devices.

High-speed connectors and specialty MLCCs

High-speed connectors and multilayer ceramic capacitors (MLCCs) are experiencing measurable tightening as hyperscale data center construction accelerates. Sourcing teams working on data center, industrial computing, or AI-edge applications should proactively build buffer stock in these categories. Murata announced increases of 15% to 35% on passives for AI servers. KEMET (Yageo) raised polymer tantalum capacitor prices by 15% to 30% in Q1 2026.

Legacy logic components and end-of-life parts

Many 74xx, CD4000, and older interface families are end-of-life or severely backordered. Tantalum capacitors, high-voltage MLCCs, and polymer aluminum capacitors critical for defense and aerospace continue to face shortages.

A special case: Nexperia

Nexperia’s wafer supply has been halted since October 2025 following export control measures, meaning there is no raw material feed for new production. The company has provided no confirmed timeline for supply resumption. For teams with Nexperia-sourced discretes, logic ICs, or transistors in their BOM, the practical response is to pursue approved alternative sourcing without delay.

Summary

The strategy that sets successful teams apart is anticipating 12 to 18 months ahead, continuously auditing the BOM, qualifying second sources before they are needed, and abandoning just-in-time practices for critical part numbers.

Are some of these components on your BOM?

If you are facing allocation issues, extended lead times, or unexpected price increases on any of the components mentioned in this article, ARTRONIK can help. We specialize in sourcing hard-to-find, allocated, and end-of-life electronic components through our global network of franchised and pre-approved suppliers.

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Texas Instruments: An Unprecedented Two-Wave Price Offensive

Texas Instruments was the first to pull the pricing lever, and it did so with a scale rarely seen in the analog market.

First wave — Q3 2025: More than 60,000 part numbers were affected by increases ranging from 10% to over 30%. The move sent a strong signal to the entire market: after two years of aggressive price competition in distribution channels, TI was making clear it intended to restore long-term profitability.

Second wave — April 1, 2026: A new, more targeted round of increases hit digital isolators, power management ICs, and industrial and automotive components. Adjustments this time ranged from 15% to as high as 85% on select part numbers — a ceiling that caught the market off guard.

TI’s logic is consistent with its broader industrial strategy: the company has invested heavily over the past several years in new 300mm fabs in the United States. These price increases are partly designed to absorb the depreciation on those assets and restore margins that were compressed during the 2023–2024 down cycle. This is not a reaction to an immediate supply shortage — it is a deliberate, long-term repositioning of TI’s pricing policy.

NXP: A Second Price Adjustment Effective June 1, 2026

NXP took a measured and direct approach. In an official letter dated May 1, 2026, sent to its customers, the company announced price adjustments effective June 1, 2026, citing inflationary cost pressures across several areas it explicitly describes as “beyond our control.”

The factors officially cited by NXP are:

• Raw materials: Rising procurement costs on key input materials
• Energy: Increased operational costs across the manufacturing chain
• Labor: Wage inflation in production regions
• Logistics: Higher transportation and distribution costs
• Supplier inputs: Upstream cost pressure passed through by subcontractors and equipment suppliers

Notably, NXP provides no overall percentage figure in its letter. Part-specific pricing details will be communicated directly by NXP account managers to each customer individually. This deliberately tailored approach contrasts with the broader public announcements made by TI or ADI, and reflects the highly segmented nature of NXP’s portfolio (automotive, industrial, IoT).

For affected buyers, the recommended course of action is to proactively reach out to your NXP account manager before June 1 to obtain the specific pricing grid for your part numbers and assess the impact on your production costs.

The Rest of the Industry: A Wave That Now Covers the Entire Market

The movement initiated by TI has spread across the industry within just a few months. Here is a summary of the main price increases announced:

Analog Devices (ADI) — effective February 1, 2026 Full product line adjustment: 10–15% for standard commercial-grade products, approximately 15% for industrial-grade, and up to 30% on nearly 1,000 military-spec part numbers (suffix /883).

STMicroelectronics — effective April 26, 2026 ST informed customers of increases citing rising material costs from its suppliers, along with higher energy, logistics, and OSAT capacity costs. Specific percentages by product line have not been made public.

Infineon — effective April 1, 2026 Price increases announced on a selection of power devices and integrated circuits. Details by part number communicated to customers individually.

ON Semiconductor (onsemi) — effective April 1, 2026 Price adjustments on certain products, in line with the broader industry trend.

Panasonic — effective February 1, 2026 Increases of 15–30% on 30 to 40 tantalum capacitor references, driven by rising material costs.

Omron — effective February 7, 2026 Increases of 5–50% across PLCs, HMIs, robotics, relays, sensors, and switches.

Intel & AMD — March and April 2026 Both CPU giants have notified customers of increases across their full processor lineups, in the range of 10–15%.

What Is Driving This Industry-Wide Surge?

Several structural factors are converging to create the conditions for these coordinated price increases:

Raw materials under pressure. Copper prices have risen more than 35% year-over-year. Aluminum, palladium, and silver — all critical to chip packaging — have followed similar trajectories.

Foundries running at capacity. SMIC and Hua Hong are reporting utilization rates above 95%. TSMC has raised prices on 3nm and below nodes by 3–10% for 2026, with similar pressures on mature nodes. Vanguard, PSMC, and UMC are planning 10% increases by Q2 2026.

AI as an unexpected demand driver. AI infrastructure growth is now pulling demand well beyond GPUs: power conversion components, signal chain, connectivity, industrial and automotive electronics are all benefiting from this dynamic — and it is giving suppliers the confidence to rebuild pricing power across broader portfolios.

Inventory cycle turning. After two years of channel oversupply, stock levels are normalizing. Buyers who had been able to leverage competition to secure floor pricing now find themselves in a significantly weaker negotiating position.

What This Means for Your Procurement Strategy

This wave of price increases is unlikely to be an isolated event. It marks the beginning of a medium-term repricing cycle across the analog, automotive, and industrial semiconductor segments. A few actions worth taking now:

• Audit your BOM to identify the TI, NXP, ADI, Infineon, and ST part numbers most exposed to increases, particularly in industrial and automotive product lines.
• Review your procurement schedule on active projects: low-cost channel inventory is disappearing fast following the price announcements, as distributors have already begun revaluing their positions.
• Get ahead of lead times: saturation of 8-inch foundry capacity may create allocation pressure on certain families of analog components and MCUs.
• Diversify your sources: where qualified equivalents exist, identify second sources for the part numbers with the highest budgetary impact.

Sources: Official NXP Semiconductors letter dated May 1, 2026; TrendForce, Semicone Electronics, FTC Electronics, 24/7 Wall St., Manufacturing Dive, Utmel — March/April 2026. Price increase percentages (except ADI and TI Q3 2025) are sourced from distributor communications and specialist trade media; cross-reference with official manufacturer notifications before making procurement decisions.

We are delighted to introduce Shanghai Fudan Microelectronics Group Co., Ltd. (FMSH) as our new manufacturing partner — a Chinese pioneer in integrated circuit design, dual-listed in Hong Kong and on the Shanghai STAR Market, specialising in security chips, identification, smart metering and non-volatile memory.

Introducing Fudan Microelectronics

Founded in July 1998 and headquartered in Shanghai, China, Shanghai Fudan Microelectronics Group Co., Ltd. (FMSH) is the first Chinese integrated circuit design company to have been listed on a stock exchange. Introduced on the Hong Kong Stock Exchange in 2000 (code: 01385.HK), transferred to the Hong Kong Main Board in 2014, and listed on the Shanghai STAR Market in 2021, FMSH holds a unique “A+H” dual capital structure.

Operating under the Fabless model, FMSH concentrates its resources on the design and development of very large-scale integrated circuits (VLSI) and their associated system solutions. The company collaborates closely with leading academic institutions, including the IC Technology Centre of Fudan University and the SOC Laboratory of the University of Science and Technology of China. Its products are sold in more than 30 countries and regions worldwide.

“Better chips, better future.”

— Official FMSH slogan

Product Portfolio

A Complete Range of Specialised Integrated Circuits

FMSH structures its offering around four major product families, covering critical applications ranging from financial security to energy management.

Security and Identification FMSH’s flagship range, comprising CPU smart card chips (contact, contactless and dual-interface), RFID chips (UHF and HF), NFC chips (tag and channel), secured encryption chips, reader chips and embedded identification chips. These components equip bank cards, social security cards, urban transport cards, electronic licences and mobile payment systems.

Smart Meters Dedicated ASIC chips for smart meters, automotive MCUs, ultra-low-power general-purpose MCUs, and ePLC (Electronic Power Line Communication) circuits for power grid management and power line communication.

NVM — Non-Volatile Memory EEPROM, SPI NOR Flash and SLC NAND Flash for applications requiring reliable and durable data storage. These memories are qualified for demanding industrial and embedded applications.

Specific Analog Circuits Leakage protection circuit series (LPCS) of type A, S and over/under-voltage, telecommunication circuits, and motorcycle/automotive electronics.

System Solutions

FMSH goes beyond component supply: the company offers complete, integrated system solutions for each target market.

Application Markets

Why Choose FMSH

China’s First Listed IC Design Company FMSH is the first integrated circuit design company to have been listed on a stock exchange in China, with more than 25 years of experience and a solid governance structure validated by the Hong Kong and Shanghai markets.

International-Grade Security Expertise FMSH bank card chips have obtained the EMVCo chip security certification — the most stringent international standard in electronic payment. The company masters the most advanced cryptographic algorithms and security protocols.

Fabless Model, State-of-the-Art EDA Tools FMSH uses industry-leading EDA tools and has developed its own microcontroller IP cores, as well as a fully automated design flow from HDL (VHDL/Verilog) through to layout and verification.

Recognised Quality Certifications ISO 9001 since December 1999, HSPM IECQ QC 080000 (SGS, 2008) and ISO 14064-1 (2012). A rigorous quality control system applied across every product family.

Academic Excellence in Collaboration Structural links with Fudan University and the University of Science and Technology of China, providing direct access to the best engineers and cutting-edge IC design research.

Global Presence Products deployed in more than 30 countries, with plans to establish overseas R&D centres to build a worldwide technical development network.

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Whether you need datasheets, samples, a quotation or technical guidance on FMSH products, our team is at your disposal. Please fill in the form below and your regional sales manager will get back to you as soon as possible.

Wir freuen uns, Shanghai Fudan Microelectronics Group Co., Ltd. (FMSH) als unseren neuen Herstellungspartner vorzustellen — einen chinesischen Pionier im Bereich der integrierten Schaltkreise, dual notiert an der Hongkonger Börse und am Shanghaier STAR-Markt, spezialisiert auf Sicherheitschips, Identifikation, intelligente Zählung und nichtflüchtige Speicher.

Wir stellen vor: Fudan Microelectronics

Gegründet im Juli 1998 und mit Hauptsitz in Shanghai, China, ist Shanghai Fudan Microelectronics Group Co., Ltd. (FMSH) das erste chinesische Unternehmen für die Entwicklung integrierter Schaltkreise, das an einer Börse notiert wurde. Im Jahr 2000 an der Hongkonger Börse eingeführt (Code: 01385.HK), 2014 in das Hauptsegment der Hongkonger Börse überführt und 2021 am STAR-Markt Shanghai notiert, verfügt FMSH über eine einzigartige „A+H”-Kapitalstruktur.

Im Rahmen des Fabless-Modells konzentriert FMSH seine Ressourcen auf die Konzeption und Entwicklung hochintegrierter Schaltkreise (VLSI) und der dazugehörigen Systemlösungen. Das Unternehmen arbeitet eng mit führenden akademischen Einrichtungen zusammen, darunter das IC-Technologiezentrum der Fudan-Universität und das SOC-Labor der Universität für Wissenschaft und Technologie Chinas. Seine Produkte werden in mehr als 30 Ländern und Regionen weltweit vertrieben.

„Better chips, better future — bessere Chips für eine bessere Zukunft.” — Offizieller FMSH-Slogan

Produktportfolio

Eine Vollständige Palette Spezialisierter Integrierter Schaltkreise

FMSH gliedert sein Angebot in vier Hauptproduktfamilien, die kritische Anwendungen von der Finanzsicherheit bis zum Energiemanagement abdecken.

Sicherheit und Identifikation Das Flaggschiff-Sortiment von FMSH umfasst CPU-Chipkarten (Kontakt, kontaktlos und Dual-Interface), RFID-Chips (UHF und HF), NFC-Chips (Tag und Kanal), gesicherte Verschlüsselungschips, Lesegerät-Chips und eingebettete Identifikationschips. Diese Komponenten werden in Bankkarten, Sozialversicherungskarten, städtischen Fahrkarten, elektronischen Lizenzen und mobilen Zahlungssystemen eingesetzt.

Intelligente Zähler Dedizierte ASIC-Chips für intelligente Zähler, Automotive-MCUs, Ultra-Niedrigverbrauchs-MCUs für allgemeine Zwecke sowie ePLC-Schaltkreise (Electronic Power Line Communication) für das Stromnetzmanagement und die Powerline-Kommunikation.

NVM — Nichtflüchtiger Speicher EEPROM, SPI NOR Flash und SLC NAND Flash für Anwendungen, die eine zuverlässige und dauerhafte Datenspeicherung erfordern. Diese Speicher sind für anspruchsvolle industrielle und eingebettete Anwendungen qualifiziert.

Spezifische Analogschaltkreise Leckschutzschaltkreis-Serien (LPCS) vom Typ A, S und Über-/Unterspannung, Telekommunikationsschaltkreise sowie Motorrad- und Kfz-Elektronik.

Systemlösungen

FMSH beschränkt sich nicht auf die Lieferung von Komponenten: Das Unternehmen bietet vollständige, integrierte Systemlösungen für jeden Zielmarkt an.

Anwendungsmärkte

Warum FMSH Wählen

Chinas Erstes Börsennotiertes IC-Designunternehmen FMSH ist das erste Unternehmen für die Entwicklung integrierter Schaltkreise, das in China an einer Börse notiert wurde, mit mehr als 25 Jahren Erfahrung und einer soliden Governance-Struktur, die durch die Märkte in Hongkong und Shanghai bestätigt wird.

Internationale Sicherheitskompetenz Die Bankkartenchips von FMSH haben die EMVCo-Chipsicherheitszertifizierung erhalten — den strengsten internationalen Standard im Bereich des elektronischen Zahlungsverkehrs. Das Unternehmen beherrscht die fortschrittlichsten kryptographischen Algorithmen und Sicherheitsprotokolle.

Fabless-Modell, Modernste EDA-Werkzeuge FMSH verwendet branchenführende EDA-Werkzeuge und hat eigene Mikrocontroller-IP-Cores sowie einen vollständig automatisierten Designablauf von HDL (VHDL/Verilog) bis zu Layout und Verifikation entwickelt.

Anerkannte Qualitätszertifizierungen ISO 9001 seit Dezember 1999, HSPM IECQ QC 080000 (SGS, 2008) und ISO 14064-1 (2012). Ein rigoroses Qualitätskontrollsystem, das auf jede Produktfamilie angewendet wird.

Akademische Zusammenarbeit auf Höchstem Niveau Strukturelle Verbindungen mit der Fudan-Universität und der Universität für Wissenschaft und Technologie Chinas ermöglichen direkten Zugang zu den besten Ingenieuren und zur Spitzenforschung im IC-Design.

Globale Präsenz Produkte in mehr als 30 Ländern im Einsatz, mit Plänen zum Aufbau von Auslands-F&E-Zentren für ein weltweites technisches Entwicklungsnetzwerk.

Kontakt Aufnehmen

Informationen, Preisanfragen oder Technischer Support

Ob Sie Datenblätter, Muster, ein Angebot oder technische Unterstützung zu FMSH-Produkten benötigen — unser Team steht Ihnen zur Verfügung. Bitte füllen Sie das untenstehende Formular aus und Ihr regionaler Vertriebsleiter wird sich so bald wie möglich bei Ihnen melden.

Nous nous réjouissons de présenter Shanghai Fudan Microelectronics Group Co., Ltd. (FMSH) comme notre nouveau fabricant partenaire — pionnier chinois de la conception de circuits intégrés, coté à Hong Kong et sur le marché STAR de Shanghai, spécialisé dans les puces de sécurité, d’identification, de comptage intelligent et de mémoire non volatile.

Découvrez Fudan Microelectronics

Fondée en juillet 1998 et dont le siège est à Shanghai, Chine, Shanghai Fudan Microelectronics Group Co., Ltd. (FMSH) est la première société chinoise de conception de circuits intégrés à avoir été cotée en bourse. Introduite à Hong Kong en 2000 (code : 01385.HK), transférée au Main Board de Hong Kong en 2014, puis cotée sur le marché STAR de Shanghai en 2021, FMSH affiche une structure de capital unique en « A+H ».

Opérant selon le modèle Fabless, FMSH concentre ses ressources sur la conception et le développement de circuits intégrés à très grande échelle (VLSI) et les solutions système associées. La société collabore étroitement avec des instituts académiques de premier rang, notamment le Centre Technologique IC de l’Université Fudan et le Laboratoire SOC de l’Université des Sciences et Technologies de Chine. Ses produits sont vendus dans plus de 30 pays et régions à travers le monde.

« Better chips, better future — des puces meilleures pour un avenir meilleur. » — Slogan officiel de FMSH

Portefeuille de Produits

Une Gamme Complète de Circuits Intégrés Spécialisés

FMSH structure son offre autour de quatre grandes familles de produits, couvrant des applications critiques allant de la sécurité financière à la gestion de l’énergie.

Sécurité et Identification La gamme phare de FMSH, comprenant les puces pour cartes à puce CPU (contact, sans contact, double interface), les puces RFID (UHF et HF), les puces NFC (tag et canal), les puces de chiffrement sécurisé, les puces de lecteur et les puces d’identification embarquées. Ces composants équipent les cartes bancaires, les cartes de sécurité sociale, les cartes de transport urbain, les licences électroniques et les systèmes de paiement mobile.

Compteurs Intelligents Puces ASIC dédiées aux compteurs intelligents, MCU automotive, MCU ultra-basse consommation à usage général, et circuits ePLC (Electronic Power Line Communication) pour la gestion du réseau électrique et la communication sur ligne de puissance.

NVM — Mémoire Non Volatile EEPROM, SPI NOR Flash et SLC NAND Flash pour des applications nécessitant un stockage fiable et durable des données. Ces mémoires sont qualifiées pour des usages industriels et embarqués exigeants.

Circuits Analogiques Spécifiques Circuits de protection contre les fuites de courant (LPCS) de type A, S et à surtension/sous-tension, circuits de télécommunication, et électronique moto/automobile.

Solutions Système

FMSH ne se contente pas de fournir des composants : la société propose des solutions système complètes et intégrées pour chaque marché cible.

Marchés d’Application

Pourquoi Choisir FMSH

Premier concepteur de CI coté en Chine FMSH est la première société de conception de circuits intégrés à avoir été cotée en bourse en Chine, avec plus de 25 ans d’expérience et une structure de gouvernance solide validée par les marchés de Hong Kong et de Shanghai.

Expertise en sécurité de niveau international Les puces carte bancaire de FMSH ont obtenu la certification de sécurité chip EMVCo — la norme internationale la plus exigeante dans le domaine du paiement électronique. La société maîtrise les algorithmes cryptographiques et les protocoles de sécurité les plus avancés.

Modèle Fabless, outils EDA de pointe FMSH utilise les meilleurs outils EDA du marché et a développé ses propres IP cores microcontrôleurs, ainsi qu’un flux de conception automatisé complet du HDL (VHDL/Verilog) jusqu’au layout et à la vérification.

Certifications qualité reconnues ISO 9001 depuis décembre 1999, HSPM IECQ QC 080000 (SGS, 2008) et ISO 14064-1 (2012). Un système de contrôle qualité rigoureux appliqué à chaque famille de produits.

Collaboration académique d’excellence Liens structurels avec l’Université Fudan et l’Université des Sciences et Technologies de Chine, permettant un accès direct aux meilleurs ingénieurs et à la recherche de pointe en conception IC.

Présence mondiale Produits déployés dans plus de 30 pays, avec des projets de centres de R&D à l’étranger pour constituer un réseau mondial de développement technique.

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