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UTC (Unisonic Technologies) – The MOSFET Range: A Complete Offering for All Power Electronics Needs

Founded in 1990 in Taipei, Unisonic Technologies Co., Ltd. (UTC) has established itself as a world-class leader in power semiconductors and analog integrated circuits. Its power MOSFET range (en.unisonic.com.tw) is one of the most comprehensive on the market, covering an exceptionally broad spectrum of technologies and applications.

A Strategy Built Around Replacing Major Brands

UTC offers a cross-reference search tool on its website, allowing users to quickly identify the UTC equivalent of any existing component. Competitor references covered include Infineon, STMicroelectronics, Vishay, IR, Fairchild/On-Semi, Nexperia, AOS, Rohm, and Toshiba. This direct substitution approach is at the heart of UTC’s product strategy. The company operates as an IDM (Integrated Device Manufacturer): design, wafer fabrication, packaging, and testing are all handled entirely in-house, in facilities certified to ISO 9001, ISO 14001, and IATF 16949.

A Range Structured into 11 Sub-Families

  • JFET — Junction field-effect transistors for switching and low-power amplification applications.
  • Combo Power MOSFET — N+P or dual-channel combinations in a single package, suited to half-bridge topologies and space-constrained applications.
  • Trench Power MOSFET (N-CH and P-CH) — Trench technology offering low on-state resistance (RDS(on)) for voltages from 10 to 250 V. These components are direct drop-in replacements for On-Semi, AOS, Rohm, and Toshiba references.
  • SiC MOSFET (N-CH) — Silicon carbide MOSFETs for high-voltage and high-temperature applications: EV chargers, solar inverters, and industrial power supplies.
  • SGT Power MOS — Shield Gate Trench (SGT) technology for improved RDS(on) and switching speed performance.
  • eGaN FET — Gallium nitride (GaN)-based transistors for very high frequency and very high power density applications.
  • Planar Power MOSFET (N-CH and P-CH) — Planar technology up to 1800 V, with direct equivalents to Vishay, Infineon (IR), and Fairchild/On-Semi references.
  • Fast Body Diode Power MOSFET (N-CH) — MOSFETs with a fast body diode, designed for synchronous rectification topologies.

Depletion Mode MOSFET — Normally-on MOSFETs used in startup circuits and protection stages.

A Wide Range of Packages

UTC offers a particularly extensive packaging portfolio, covering both through-hole (THD) and surface-mount (SMD) formats, from classic to the very latest options. Available packages for power MOSFETs include:

  • Through-hole packages (THD) — TO-92, TO-126, TO-220 (and variants: TO-220F, TO-220B, TO-220FLP, TO-220FJ…), TO-247 (and variants), TO-251, TO-252, TO-262, TO-263, TO-277, TO-3P (and variants), TO-230.
  • Compact SMD packages — SOT-23, SOT-89, SOT-223, SOT-363, SOT-523, SOT-553, SOT-723, as well as DFN formats (DFN2020-6, DFN3030-8, DFN5060-8…), PDFN (PDFN3x3, PDFN5x6), and X2DFN (1010, 1616, 8080).
  • SMD power packages — TO-252 (D-PAK), TO-263 (D²-PAK), TO-262, and the TOLL (TO-Leadless) format, available in TOLL-8A and TOLL-8B variants — a modern low-inductance format particularly suited to high-density automotive and industrial applications.

UTC continuously develops new high-power and miniaturized packages in response to market trends, offering a diverse range of packaging options from traditional THD formats to the latest TOLL formats. Dimensional data sheets (PDF) and 3D views for each package are available on the Package page of the website.

An IDM Model That Guarantees Availability

UTC operates three wafer fabrication plants (Taipei, Fuzhou, Xiamen) and one packaging and testing facility, all certified to ISO 9001, ISO 14001, and IATF 16949. This IDM model ensures full control over capacity, production, and technological independence — with no reliance on external foundries. UTC emphasizes its ability to supply high-quality products with no End-of-Life (EoL) risk on its active references.

Applications

UTC MOSFETs are used across a wide range of applications: switching power supplies, photovoltaic inverters, energy storage, variable frequency drives, EV charging stations, consumer electronics, lighting, home automation, and automotive electronics.


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